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Multi Layer FR4 PCB Board High Tg Lead Free 400mmX500mm

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Multi Layer FR4 PCB Board High Tg Lead Free 400mmX500mm

Brand Name : Bicheng

Model Number : BIC-506.V1.0

Certification : UL, ISO9001, IATF16949

Place of Origin : CHINA

MOQ : 1PCS

Payment Terms : T/T

Supply Ability : 5000PCS per month

Delivery Time : 8-9 working days

Packaging Details : Vacuum bags+Cartons

Base material : High Tg, Lead Free High Reliability Epoxy Resin

Layer count : Double Layer, Multilayer, Hybrid PCB

PCB thickness : 0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.6mm, 1.8mm, 2.0mm, 2.4mm, 3.0mm, 3.2mm

PCB size : ≤400mm X 500mm

Solder mask : Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red etc.

Copper weight : 0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm)

Surface finish : Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion Silver etc..

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High Tg Multi-layer Printed Circuit Board (PCB) on IT-180ATC and IT-180GNBS Lead Free Compliance

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

General Description

IT-180ATC is an advanced high Tg (175℃ by DSC) multifunctional filled epoxy with high thermal reliability and CAF resistance. It’s suitable for various applications and can pass 260℃ lead free assembly. Thickness ranges 0.5mm to 3.2mm, copper weight 0.5oz to 3oz.

Applications

Automotive (Engine room ECU)

Multilayer and HDI PCB

Backplanes

Data Storage

Server and Networking

Telecommunications

Heavy Copper

Multi Layer FR4 PCB Board High Tg Lead Free 400mmX500mm

Key Features

Low CTE

High heat resistance

Excellent CAF resistance

Good through-hole reliability

Our PCB Capability (IT-180ATC)

PCB Material: High Tg, Lead Free High Reliability Epoxy Resin
Designation: IT-180ATC
Dielectric constant: 4.4 at 1GHz
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm)
PCB thickness: 0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.6mm, 1.8mm, 2.0mm, 2.4mm, 3.0mm, 3.2mm
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion Silver etc..
Technology: HDI, Via in pad, Impedance Control, Blind via/Buried via, Edge Plating, BGA, Countsunk Holes etc.

General Properties of IT-180ATC

Items IPC TM-650 Typical Value Unit
Peel Strength, minimum 2.4.8 lb/inch
A. Low profile copper foil 5
B. Standard profile copper foil 8
Volume Resistivity 2.5.17.1 1x109 M-cm
Surface Resistivity 2.5.17.1 1x108 M
Moisture Absorption, maximum 2.6.2.1 0.1 %
Permittivity (Dk, 50% resin content) --
A. 1MHz 2.5.5.9 4.5
B. 1GHz 2.5.5.9 4.4
Loss Tangent (Df, 50% resin content) --
A. 1MHz 2.5.5.9 0.014
B. 1GHz 2.5.5.9 0.015
Flexural Strength, minimum N/mm2
A. Length direction 2.4.4 500-530
B. Cross direction 410-440
Thermal Stress 10 s at 288°C
A. Unetched 2.4.13.1 Pass Rating
B. Etched Pass
Flammability UL94 V-0 Rating
Comparative Tracking Index (CTI) IEC 60112 / UL 746 CTI 3 (175-249) Class (Volts)
Glass Transition Temperature(DSC) 2.4.25 175 ˚C
Decomposition Temperature 2.4.24.6 345 ˚C
X/Y Axis CTE (40℃ to 125℃) 2.4.41 11-13 / 13-15 ppm/˚C
Z-Axis CTE
A. Alpha 1 45 ppm/˚C
B. Alpha 2 2.4.24 210 ppm/˚C
C. 50 to 260 Degrees C 2.7 %
Thermal Resistance
A. T260 2.4.24.1 >60 Minutes
B. T288 20 Minutes

Multi Layer FR4 PCB Board High Tg Lead Free 400mmX500mm


Product Tags:

Multi Layer FR4 PCB Board

      

Lead Free PCB Printed Circuit Board

      

400mmX500mm Printed Circuit Board

      
China Multi Layer FR4 PCB Board High Tg Lead Free 400mmX500mm factory

Multi Layer FR4 PCB Board High Tg Lead Free 400mmX500mm Images

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