In the world of electronics, the choice of printed circuit board (PCB) material can significantly impact performance, especially in high-frequency and high-power applications. Our double-sided PCB constructed from RT/duroid 6035HTC stands out as a premier solution for engineers and designers seeking reliability, efficiency, and advanced functionality.
PCB Construction and Specifications
Base Material: RT/duroid 6035HTC
RT/duroid 6035HTC is a ceramic-filled PTFE composite renowned for its high thermal conductivity and excellent dielectric properties. This material is particularly suited for high-power RF and microwave applications, offering characteristics that surpass traditional laminates.
Detailed Specifications
- Layer Count: This PCB features a double-sided design, allowing for efficient routing of complex circuits in a compact footprint.
- Dimensions: Measuring 43mm x 107mm (± 0.15mm), this PCB is designed for versatility in various applications.
- Trace and Space Requirements: With a minimum trace/space of 4/7 mils, this PCB supports high-density designs without compromising signal integrity.
- Hole Size and Vias: The minimum hole size is 0.3mm, and the board includes 71 vias, enhancing connectivity without the complications of blind vias.
- Finishing Touches: The immersion silver surface finish provides excellent solderability and corrosion resistance, while the 100% electrical testing prior to shipment ensures reliability.
Layer Stackup
The stackup of this PCB consists of:
- Copper Layer 1: 35 μm
- RT/duroid 6035HTC Core: 1.524 mm (60 mils)
- Copper Layer 2: 35 μm
This configuration optimizes thermal management and electrical performance, ensuring robust operation in high-frequency applications.
| RT/duroid 6035HTC Typical Value |
| Property | RT/duorid 6035HTC | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.50±0.05 | Z | | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline |
| Dielectric Constant,εDesign | 3.6 | Z | | 8 GHz - 40 GHz | Differential Phase Length Method |
| Dissipation Factor | 0.0013 | Z | | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 |
| Thermal Coefficient of ε | -66 | Z | ppm/℃ | -50 ℃to 150℃ | mod IPC-TM-650, 2.5.5.5 |
| Volume Resistivity | 108 | | MΩ.cm | A | IPC-TM-650, 2.5.17.1 |
| Surface Resistivity | 108 | | MΩ | A | IPC-TM-650, 2.5.17.1 |
| Dimensional Stability | -0.11 -0.08 | CMD MD | mm/m (mils/inch) | 0.030" 1oz EDC foil Thickness after etch '+E4/105 | IPC-TM-650 2.4.39A |
| Tensile Modulus | 329 244 | MD CMD | kpsi | 40 hrs @23℃/50RH | ASTM D638 |
| Moisure Absorption | 0.06 | | % | D24/23 | IPC-TM-650 2.6.2.1 ASTM D570 |
| Coefficient of Thermal Expansion (-50 ℃to 288 ℃) | 19 19 39 | X Y Z | ppm/℃ | 23℃ / 50% RH | IPC-TM-650 2.4.41 |
| Thermal Conductivity | 1.44 | | W/m/k | 80℃ | ASTM C518 |
| Density | 2.2 | | gm/cm3 | 23℃ | ASTM D792 |
| Copper Peel Stength | 7.9 | | pli | 20 sec. @288 ℃ | IPC-TM-650 2.4.8 |
| Flammability | V-0 | | | | UL 94 |
| Lead-Free Process Compatible | Yes | | | | |
Performance Characteristics
Dielectric Properties
The PCB's dielectric constant (DK) of 3.5 ± 0.05 at 10 GHz and a low dissipation factor of 0.0013 means it can handle high-frequency signals with minimal loss. These properties are crucial for applications requiring precision and clarity in signal transmission.
Thermal Management
With a thermal conductivity of 1.44 W/m/K at 80°C, RT/duroid 6035HTC excels in heat dissipation. This capability is vital for high-power applications, where excessive heat can lead to performance degradation or failure. The high thermal stability ensures that the PCB maintains its integrity even under extreme conditions.
Coefficient of Thermal Expansion (CTE)
The CTE values—19 ppm/°C in the X and Y axes and 39 ppm/°C in the Z-axis—indicate the PCB's dimensional stability across temperature variations. This stability is essential for maintaining the reliability of connections and overall circuit performance.
Benefits of RT/duroid 6035HTC PCB
1. High Thermal Conductivity: Effective heat dissipation lowers operating temperatures, enhancing long-term reliability in demanding applications.
2. Excellent Dielectric Performance: Reduced insertion loss and superior signal integrity are achieved, making this PCB ideal for high-frequency circuits.
3. Robust Stability: The thermal stability of the material ensures consistent performance, even in challenging environments.
Applications
This double-sided PCB is tailored for a variety of demanding applications, including:
- High Power RF Amplifiers: Essential for telecommunications and broadcasting, where signal strength is paramount.
- Microwave Applications: Used in radar systems, satellite communications, and medical imaging.
- Power Dividers and Couplers: Critical for signal management in complex circuitry, ensuring efficient distribution of power.
Conclusion
The RT/duroid 6035HTC double-sided PCB is a top-tier solution for engineers and designers in need of high-performance, reliable circuit boards for advanced applications. With its exceptional thermal and electrical properties, this PCB not only meets but exceeds the rigorous demands of modern electronics.
For any inquiries or to discuss how our RT/duroid 6035HTC PCB can meet your specific needs, please contact our sales team. We are here to support your projects with expertise and high-quality solutions.
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Double Sided PCB RT Duroid 6035HTC 60mil White Silkscreen Immersion Silver Images
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