As the demand for advanced electronic solutions grows, the need for high-quality printed circuit boards (PCBs) has never been more critical. Our newly shipped 2-layer rigid PCB, constructed using RF-10 material, offers exceptional performance tailored for a variety of applications, particularly in the RF sector.
1. Technical Specifications
PCB Construction
- Base Material: RF-10, a composite of ceramic-filled PTFE and woven fiberglass.
- Board Dimensions: 64mm x 45.7mm (± 0.15mm), providing a compact form factor.
- Finished Board Thickness: 1.6mm, ensuring durability and robustness.
- Finished Copper Weight: 1oz (1.4 mils) for outer layers, supporting efficient signal transmission.
- Minimum Trace/Space: 4/6 mils, allowing for high-density designs.
- Minimum Hole Size: 0.4mm, accommodating various components.
- Via Plating Thickness: 20 μm, ensuring reliable connections.
- Surface Finish: Immersion tin, offering excellent solderability and corrosion resistance.
- Electrical Testing: Each PCB undergoes a 100% electrical test before shipment to guarantee reliability.
PCB Stackup
- Copper Layer 1: 35μm (1oz)
- RF-10 Core: 60mil (1.524mm), providing excellent dielectric properties.
- Copper Layer 2: 35μm (1oz)
| Property | Test Method | Unit | Value | Unit | Value |
| Dk @ 10 GHz | IPC-650 2.5.5.5.1 Mod. | | 10.2 ± 0.3 | | 10.2 ± 0.3 |
| Df @ 10 GHz | IPC-650 2.5.5.5.1 Mod. | | 0.0025 | | 0.0025 |
| TcK† (-55 to 150 °C) | IPC-650 2.5.5.6 | ppm/°C | -370 | ppm/°C | -370 |
| Moisture Absorption | IPC-650 2.6.2.1 | % | 0.08 | % | 0.08 |
| Peel Strength (1 oz. RT copper) | IPC-650 2.4.8 (solder) | lbs/in | 10 | N/mm | 1.7 |
| Volume Resistivity | IPC-650 2.5.17.1 | Mohm/cm | 6.0 x 107 | Mohm/cm | 6.0 x 107 |
| Surface Resistivity | IPC-650 2.5.17.1 | Mohm | 1.0 x 108 | Mohm | 1.0 x 108 |
| Flexural Strength (MD) | IPC - 650 - 2.4.4 | psi | 14,000 | N/mm2 | 96.53 |
| Flexural Strength (CD) | IPC - 650 - 2.4.4 | psi | 10,000 | N/mm2 | 68.95 |
| Tensile Strength (MD) | IPC - 650 - 2.4.19 | psi | 8,900 | N/mm2 | 62.57 |
| Tensile Strength (CD) | IPC - 650 - 2.4.19 | psi | 5,300 | N/mm2 | 37.26 |
| Dimensional Stability | IPC-650 2.4.39 (After Etch) | % (25 mil-MD) | -0.0032 | % (25 mil-CD) | -0.0239 |
| Dimensional Stability | IPC-650 2.4.39 (After Bake) | % (25 mil-MD) | -0.0215 | % (25 mil-CD) | -0.0529 |
| Dimensional Stability | IPC-650 2.4.39 (After Stress) | % (25 mil-MD) | -0.0301 | % (25 mil-CD) | -0.0653 |
| Dimensional Stability | IPC-650 2.4.39 (After Etch) | % (60 mil-MD) | -0.0027 | % (60 mil-CD) | -0.0142 |
| Dimensional Stability | IPC-650 2.4.39 (After Bake) | % (60 mil-MD) | -0.1500 | % (60 mil-CD) | -0.0326 |
| Dimensional Stability | IPC-650 2.4.39 (After Stress) | % (60 mil-MD) | -0.0167 | % (60 mil-CD) | -0.0377 |
| Density (Specific Gravity) | IPC-650-2.3.5 | g/cm3 | 2.77 | g/cm3 | 2.77 |
| Specific Heat | IPC-650-2.4.50 | J/g°C | 0.9 | J/g°C | 0.9 |
| Thermal Conductivity (Unclad) | IPC-650-2.4.50 | W/M*K | 0.85 | W/M*K | 0.85 |
| CTE (X -Y axis) (50 to 150 °C) | IPC-650 2.4.41 | ppm/°C | 16-20 | ppm/°C | 16-20 |
| CTE (Z axis) (50 to 150 °C) | IPC-650 2.4.41 | ppm/°C | 25 | ppm/°C | 25 |
| Flammability Rating | Internal | | V-0 | | V-0 |
2. Advantages of RF-10 Material
High Dielectric Constant
With a dielectric constant of 10.2 ± 0.3 at 10GHz, RF-10 allows for significant size reduction in RF circuits. This feature is crucial for modern devices that need to be both compact and efficient.
Low Dissipation Factor
RF-10 boasts a dissipation factor of 0.0025 at 10GHz, minimizing energy loss and enhancing overall circuit performance. This characteristic is vital for high-frequency applications where signal integrity is paramount.
Excellent Dimensional Stability
The thin woven fiberglass reinforcement provides improved rigidity and dimensional stability, ensuring that the PCB can endure the stresses of manufacturing and operation without compromising performance.
High Thermal Conductivity
With a thermal conductivity of 0.85 W/mk, RF-10 effectively manages heat, making it suitable for high-power applications where thermal management is essential.
Flammability Rating
The material is rated V-0 for flammability, adding an extra layer of safety for applications in sensitive environments.
3. Applications
- Microstrip Patch Antennas: Ideal for wireless communication systems.
- GPS Antennas: Ensuring accurate positioning and navigation.
- Passive Components: Such as filters, couplers, and power dividers, essential for signal processing.
- Aircraft Collision Avoidance Systems: Enhancing safety in aviation.
- Satellite Components: Supporting reliable communication in space applications.
4. Quality Assurance and Compliance
All our PCBs are manufactured to meet IPC-Class-2 standards, ensuring high quality and reliability. The rigorous 100% electrical testing process provides peace of mind, guaranteeing that each board functions as intended.
5. Global Availability
We are proud to offer our 2-layer rigid PCB globally, allowing clients from various sectors to access this state-of-the-art technology. Our commitment to quality and customer satisfaction ensures that you receive a product that meets your exact specifications.
Conclusion
In summary, our newly shipped 2-layer rigid PCB with RF-10 material represents a significant advancement in PCB technology. With its impressive specifications, material advantages, and suitability for a wide range of applications, this PCB is poised to meet the demands of today’s electronic landscape.
Reach out to us today to learn more about our PCBs or place an order!
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RF-10 PCB Double-Side 60mil 1.524mm Immersion Tin Finished Images
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