This rigid 2-layer Taconic TLX-9 RF PCB is manufactured with high-performance PTFE woven glass composite, widely recognized as a cost-effective low-loss substrate for microwave radio frequency circuits. Adopting nickel-free EPIG surface finish and produced strictly in accordance with IPC-Class-2 industrial standards, this 0.3mm ultra-thin PCB delivers a stable low dielectric constant, ultra-low dissipation factor, and negligible moisture absorption. Compared with expensive Rogers microwave materials, Taconic TLX-9 provides equivalent electrical stability with a more competitive price. Featuring reliable mechanical durability and consistent high-frequency performance, this custom RF circuit board is ideal for LNAs, LNBs, PCS/PCN large-format antennas, high-power amplifiers, and passive RF components.
PCB Specifications
| Construction Item |
Details |
| Base Material |
Taconic TLX-9 – Low-loss PTFE woven glass composite laminate optimized for high-frequency circuits |
| Layer Count |
2 layers – Rigid microwave PCB structure engineered for stable RF signal performance |
| Board Dimensions |
91.6mm × 45.3mm (1PCS), with a tight tolerance of +/- 0.15mm for precise assembly consistency |
| Trace & Space |
Minimum 5/6 mils, enabling compact circuit routing while preserving superior signal integrity |
| Minimum Hole Size |
0.3mm, designed for high-precision through-hole component installation |
| Vias |
No blind vias, simplifying fabrication and ensuring stable interlayer electrical connectivity |
| Finished Board Thickness |
0.3mm, ultra-thin profile ideal for space-constrained microwave electronic devices |
| Copper Weight |
1oz (1.4 mils) outer copper layers, delivering steady conductivity for RF signal transmission |
| Via Plating Thickness |
20μm, compliant with IPC-Class-2 standards to guarantee durable via conduction |
| Surface Finish |
EPIG (Nickel-free), featuring high conductivity and exceptional corrosion resistance for high-frequency circuits |
| Silkscreen & Solder Mask |
Top Silkscreen: None; Bottom Silkscreen: None; Top Solder Mask: None; Bottom Solder Mask: None — Fully exposed copper minimizes high-frequency signal attenuation |
| Quality Testing |
100% electrical testing conducted prior to shipment to ensure reliable circuit performance |
PCB Stack-up Configuration
| Stack-up Component |
Specifications & Description |
| Copper Layer 1 |
35μm – High-purity copper layer for low-resistance microwave signal conduction |
| Taconic TLX-9 Core |
0.254 mm (10mil) – Low-loss PTFE composite substrate for consistent high-frequency performance |
| Copper Layer 2 |
35μm – Symmetrical copper layout to maintain excellent electrical stability |
Artwork Format & Compliance Standard
Artwork Format: Delivered in Gerber RS-274-X, the universal industrial standard ensuring high-precision PCB fabrication and full data compatibility.
Accepted Standard: IPC-Class-2, ensuring stable and long-term service performance for industrial high-frequency electronic devices.
Availability: Global shipping service is provided to support worldwide engineering procurement and industrial projects.
Introduction of Taconic TLX-9 Substrate
Taconic TLX-9 is a high-performance PTFE woven glass composite laminate tailored for advanced microwave circuits. It features tightly regulated electrical and mechanical properties, and is compatible with conventional manufacturing procedures including shearing, drilling, milling and plating. This substrate boasts exceptional dimensional stability and nearly zero moisture absorption throughout the production process.
TLX-9 maintains a steady dielectric constant of 2.5 across a wide frequency and temperature spectrum, accompanied by an ultra-low dissipation factor of 0.0019 at 10 GHz. Moreover, it is certified with UL 94 V-0 flame retardant rating, meeting stringent fire-resistance requirements for electronic industrial applications.
Key Features
| Property |
Test Method |
Units |
Value |
Units |
Value |
| Dielectric Constant @ 10 GHz |
IPC-TM 650 2.5.5.5 |
|
2.5 |
|
2.5 |
| Dissipation Factor @ 10 GHz |
IPC-TM 650 2.5.5.5 |
|
0.0019 |
|
0.0019 |
| Moisture Absorption |
IPC-TM 650 2.6.2.1 |
% |
<0.02 |
% |
<0.02 |
| Dielectric Breakdown |
IPC-TM 650 2.5.6 |
kV |
>60 |
kV |
>60 |
| Volume Resistivity |
IPC-TM 650 2.5.17.1 |
Mohm/cm |
10^7 |
Mohm/cm |
10^7 |
| Surface Resistivity |
IPC-TM 650 2.5.17.1 |
Mohm |
10^7 |
Mohm/cm |
10^7 |
| Arc Resistance |
IPC-TM 650 2.5.1 |
seconds |
>180 |
seconds |
>180 |
| Flexural Strength Lengthwise |
IPC-TM 650 2.4.4 |
lbs./in. |
>23,000 |
N/mm2 |
>159 |
| Flexural Strength Crosswise |
IPC-TM 650 2.4.4 |
lbs./in. |
>19,000 |
N/mm2 |
>131 |
| Peel Strength (1oz copper) |
IPC-TM 650 2.4.8 |
lbs./linear in. |
12 |
N/mm |
2.1 |
| Thermal Conductivity |
ASTM F 433 |
W/m/K |
0.19 |
W/m/K |
0.19 |
| x-y CTE |
ASTM D 3386 (TMA) |
ppm/°C |
9-12 |
ppm/°C |
9-12 |
| z CTE |
ASTM D 3386 (TMA) |
ppm/°C |
130- 145 |
ppm/°C |
130- 145 |
| UL-94 Flammability Rating |
UL-94 |
|
V-0 |
|
V-0 |
Key Benefits
Taconic TLX-9 offers remarkable technical superiorities for microwave circuit designers and manufacturers:
Consistent low dielectric constant guarantees reliable signal performance at high frequencies
Ultra-low dissipation factor effectively reduces signal loss for sensitive microwave circuits
Extremely low moisture absorption ensures stable operation under harsh ambient conditions
High dielectric breakdown enhances voltage resistance for high-power RF equipment
Superior copper peel strength prevents layer delamination and improves structural durability
Optimized CTE minimizes thermal stress and effectively avoids board warpage, suitable for long-term outdoor and high-temperature RF working environments
Typical Applications
This Taconic TLX-9 RF PCB is extensively applied in high-precision microwave and radio frequency equipment:
-LNAs, LNBs, and LNCs
-PCS/PCN Large Format Antennas
-High Power Amplifiers
-Passive RF Components, RF sensing modules and communication base station circuits
