This PCB is a 4-layer hybrid Rogers RO3210 circuit board engineered for high-frequency microwave applications. It adopts a symmetrical stack-up with dual RO3210 dielectric cores bonded by premium RO4450F prepreg, delivering a consolidated lamination thickness of 1.321mm. Constructed with an asymmetric copper structure, it features 1oz outer copper and 0.5oz inner copper to optimize current conduction and impedance performance. Equipped with green solder mask, white top silkscreen, silver-gold composite plating, custom controlled depth slot and 1-3 sequential blind vias, this multilayer board complies with strict precision manufacturing standards. Benefiting from woven glass-reinforced PTFE properties, it achieves outstanding mechanical rigidity and electrical stability, suitable for base station infrastructures, automotive anti-collision systems, satellite communication terminals and wireless broadband facilities.
PCB Specifications
| Construction Item | Details |
| Base Material | Premium hybrid stack-up combining RO3210 woven glass-reinforced PTFE and RO4450F bonding prepreg, engineered for superior mechanical rigidity and stable high-frequency electrical performance |
| Layer Count | 4 layers – Industrial-grade multilayer PCB tailored for intricate microwave and RF communication circuitry |
| Board Dimensions | 95mm × 98mm (1PCS), manufactured with tight dimensional tolerance |
| Finished Pressing Thickness | 1.321mm consolidated lamination thickness, enhancing structural robustness and resisting board deformation under complex working conditions |
| Copper Weight | Outer copper: 1oz finished foil; Inner copper: 0.5oz finished foil. |
| Surface Finish | Dual Silver & Gold Composite Plating, offering outstanding oxidation resistance, superior solderability and stable high-frequency conductivity |
| Silkscreen & Solder Mask | Top: Green Solder Mask + White Silkscreen; Bottom: Green Solder Mask Without Silkscreen. Insulating protective coating improves durability and anti-corrosion capability |
| Special Structure | Controlled Depth Slot (Top to Inner Layer 1); 1-3 Layer Blind Vias. Custom precision machining for sophisticated radio frequency circuit layouts |
| Quality Testing | 100% continuity and impedance testing conducted prior to shipment to guarantee consistent electrical performance |
PCB Stack-up Configuration
| Stack-up Sequence | Material & Thickness Description |
| Copper Layer 1 (Outer) | 1oz Copper – Thick outer copper foil ensures steady transmission of high-frequency microwave signals |
| Dielectric 1 | 0.508mm Rogers RO3210 – Woven glass reinforced ceramic-filled PTFE with optimized mechanical sturdiness |
| Copper Layer 2 (Inner) | 0.5oz Copper – Lightweight inner copper for dense and intricate internal circuit traces |
| Dielectric 2 | Two pieces of 0.102mm RO4450F Prepreg (Total 0.2mm), premium bonding material delivering reliable interlayer adhesion and lamination stability |
| Copper Layer 3 (Inner) | 0.5oz Copper – Symmetrical inner copper arrangement for uniform impedance distribution |
| Dielectric 3 | 0.508mm Rogers RO3210 – Reinforced dielectric core to enhance overall board flatness and structural stability |
| Copper Layer 4 (Outer) | 1oz Copper – Heavy outer copper layer provides exceptional surface conductivity and soldering performance |
Artwork Format & Compliance Standard
Artwork Format: Supplied in Gerber RS-274-X, an industry-standard format that enables precise multilayer fabrication and universal data compatibility.
Quality Standard: Meets IPC-Class-2 criteria, ensuring long-term operational durability for industrial RF communication hardware.
Availability: Global shipping is accessible to support international industrial procurement and telecommunication engineering projects.
Introduction of Rogers RO3210 Substrate
RO3210 is a high-performance woven glass-reinforced ceramic-filled PTFE laminate categorized under Rogers RO3200™ high-frequency material series. As an upgraded iteration of the classic RO3000® series, it boasts drastically improved mechanical stability while retaining premium electrical properties. This advanced dielectric material combines the ultra-smooth surface of non-woven PTFE for fine-line etching precision and the rigid structural strength of woven glass composites, perfectly catering to sophisticated multilayer RF PCB designs.
Produced under ISO 9002 certified quality management systems, RO3210 is fully compatible with conventional PTFE fabrication workflows. It features a fixed dielectric constant of 10.2 and a low dissipation factor of 0.0027, maintaining ultra-stable low-loss characteristics across microwave frequency bands. With copper-matched thermal expansion coefficient and superior dimensional stability, this substrate is highly suitable for epoxy hybrid lamination and high-yield mass commercial production.
Key Material Parameters
| Parameter | Specification & Remarks |
| Dielectric Constant (Dk) | 10.2 @10GHz, high dielectric constant enabling compact miniaturized radio frequency circuit design |
| Dissipation Factor (Df) | 0.0027 @10GHz, minimal dielectric loss guarantees low-attenuation microwave signal transmission |
| Reinforcement Type | Woven fiberglass reinforcement, effectively enhancing board rigidity and mechanical handling performance |
| Surface Smoothness | Ultra-smooth surface achieves fine-line etching tolerance for high-precision miniaturized circuits |
| Expansion Coefficient | Copper-synchronized in-plane CTE, reducing thermal stress and improving SMT assembly reliability |
| Certification | ISO 9002 certified manufacturing system for standardized and consistent quality control |
Key Benefits
Rogers RO3210 delivers exclusive technical merits tailored for complex multilayer high-frequency circuitry:
-Woven glass reinforcement strengthens structural rigidity for simplified production handling and processing
-Consistent electrical and mechanical properties adapt to sophisticated multilayer RF structures
-Copper-matched CTE minimizes thermal deformation and ensures stable SMT soldering performance
-Excellent compatibility with epoxy prepreg supports diversified hybrid stack-up PCB designs
-Superior surface smoothness enables ultra-fine trace etching for compact miniaturized circuits
-Cost-effective raw material and high production yield lower overall bulk manufacturing costs
Typical Applications
This high-performance RO3210 hybrid PCB is widely deployed across automotive, communication, satellite and broadband industrial sectors:
-Automotive anti-collision detection systems and GPS positioning satellite antenna modules
-Wireless telecommunication infrastructures and cellular base station transceiver hardware
-Microstrip patch antennas for short-range wireless communication and signal transmission
-Direct broadcast satellite receivers and cable communication datalink transmission equipment
-Remote intelligent meter reading devices and high-frequency power backplane circuits
-LMDS communication systems and long-distance wireless broadband transmission terminals
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4-Layer Hybrid RF PCB Rogers RO3210 Substrate Silver and Gold Plating Images
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